1、SEMI PR3 6 0600 SEMI 20001 SEMI PR3 6 0600 PROPOSED SPECIFICATION FOR SURFACE MOUNT INTERFACE OF GAS DISTRIBUTION COMPONENTS H1G SEAL DESIGN This proposed specification was technically approved by the Global Facilities Committee and is the direct responsibility of the North American Facilities Commi
2、ttee Current edition approved by the North American Regional Standards Committee on April 10 2000 Initially available on SEMI OnLine May 2000 to be published June 2000 1 Purpose 1 1 This standard in conjunction with the main document establishes the properties and physical dimensions that define a c
3、omplete surface mount interface on the component for the H1G Seal design 2 Scope 2 1 The scope is identical to the main document except that it is limited to components which will employ the H1G Seal design for the sealing interface This design can be used with the H1G Seal or any compatible sealing
4、 methodologies 2 2 This standard does not purport to address safety issues if any associated with its use It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use 3 Limitations 3
5、 1 The limitations are detailed in the main document 4 Referenced Standards 4 1 The reference documents are detailed in the main document 5 Terminology 5 1 The terminology is detailed in the main document 6 Ordering Information 6 1 The ordering information is detailed in the main document 7 Requirem
6、ents 7 1 General Components must meet all the requirements of the main document 7 2 Dimensional Requirements Two port valves shall meet the requirements outlined in Figure 1 Three port valves shall meet the requirements outlined in Figure 2 All components other than valves and mass flow controllers
7、meters shall meet the requirements outlined in Figure 3 All mass flow controllers meters shall meet the requirements outlined in Figure 4 The sealing surfaces of all components shall meet the requirements outlined in Figure 5 All geometric dimensioning and tolerancing complies with ASME Y14 5 and or
8、 the applicable ISO standard NOTE 1 All dimensions are in millimeters unless otherwise noted NOTE 2 The diameter and location of the leak check ports are only specified on the interface side of the component body in the drawings The other side of the leak check port shall be located on the upper fac
9、e of the component body however the diameter and location can vary with the top portion of the component 7 3 Sealing Surface Hardness The sealing surface the bottom of the counterbore shall have a minimum hardness of 300 Vickers Testing shall be done per ISO 6507 NOTE 3 This test will damage the sea
10、ling surface and should be considered destructive in nature 7 4 Sealing Surface Roughness The sealing surface the bottom of the counterbore shall have a surface roughness of 0 2 micro meters Ra max Testing shall be done per ISO 4288 NOTE 4 This test may damage the sealing surface and may be destruct
11、ive in nature 7 5 Sealing Surface Scratches The sealing surface shall not have any radial scratches which are visible to non magnified normal vision SEMI PR3 6 0600 SEMI 20002 L LEAK CHECK PORT Figure 1 Dimensions of 2 Port Valves L LEAK CHECK PORT Figure 2 Dimensions of 3 Port Valves SEMI PR3 6 060
12、0 SEMI 20003 L LEAK CHECK PORT Figure 3 Dimensions of All Components Except MFC MFM L LEAK CHECK PORT L Figure 4 Dimensions of All MFC MFM SEMI PR3 6 0600 SEMI 20004 Figure 5 Dimensions of H1G Seal Detail NOTICE SEMI makes no warranties or representations as to the suitability of the specification s
13、et forth herein for any particular application The determination of the suitability of the specification is solely the responsibility of the user Users are cautioned to refer to manufacturer s instructions product labels product data sheets and other relevant literature respecting any materials ment
14、ioned herein These specifications are subject to change without notice The user s attention is called to the possibility that compliance with this specification may require use of copyrighted material or of an invention covered by patent rights By publication of this specification SEMI takes no posi
15、tion respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this specification Users of this specification are expressly advised that determination of any such patent rights or copyrights and the risk of infringement of such rights are entirely their own responsibility Copyright by SEMI Semiconductor Equipment and Materials International 805 East Middlefield Road Mountain View CA 94043 Reproduction of the contents in whole or in part is forbidden without express written consent of SEMI