SEMI E56-1296 TEST METHOD FOR DETERMINING ACCUSEMI E57-0600

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1、SEMI E57 0600 SEMI 1996 20001 SEMI E57 0600 MECHANICAL SPECIFICATION FOR KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 mm WAFER CARRIERS This specification was technically approved by the Global Physical Interfaces and Carriers Committee and is the direct responsibility of the North American Phy

2、sical Interfaces and Carriers Committee Current edition approved by the North American Regional Standards Committee on March 2 2000 Initially available on SEMI OnLine April 2000 to be published June 2000 Originally published in 1996 previously published February 1999 1 Purpose 1 1 This standard spec

3、ifies the mechanical couplings used to ergonomically align and precisely support 300 mm wafer carriers including transport cassettes process cassettes quartz boats pods lot boxes and shipping boxes Such a kinematic coupling can be used at several interfaces including between a box or cassette and a

4、tool load port or vehicle nest between a transport cassette and a box and between a process cassette or quartz boat and the floor of a process chamber 2 Scope 2 1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity

5、 and inter changeability at all mechanical interfaces Only the bottom half of the kinematic coupling is specified so that suppliers can be flexible in designing wafer carriers that can mate with it 2 2 This standard does not purport to address safety issues if any associated with its use It is the r

6、esponsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use 3 Referenced Standards 3 1 SEMI Standards SEMI E15 Specification for Tool Load Port SEMI E19 Standard Mechanical Interface SMIF SEMI

7、 E19 4 200 mm Standard Mechanical Interface SMIF SEMI E44 Guide for Procurement and Acceptance of Minienvironments 3 2 ISO Document1 ISO 4287 Geometrical Product Specifications GPS Surface texture Profile method Terms definitions and surface texture parameters 4 Terminology 4 1 bilateral datum plane

8、 a vertical plane that bisects the wafers and that is perpendicular to both the horizontal and facial datum planes 4 2 box a protective portable container for a cassette and or substrate s as defined in SEMI E44 4 3 cassette a open structure that holds one or more substrates as defined in SEMI E44 4

9、 4 facial datum plane a vertical plane that bisects the wafers and that is parallel to the front side of the carrier where wafers are removed or inserted On tool load ports it is also parallel to the load face plane specified in SEMI E15 on the side of the tool where the carrier is loaded and unload

10、ed 4 5 horizontal datum plane a horizontal plane from which projects the kinematic coupling pins on which the carrier sits On tool load ports it is at the load height specified in SEMI E15 and might not be physically realized as a surface 4 6 nominal wafer center line the line that is defined by the

11、 intersection of the two vertical datum planes facial and bilateral and that passes through the nominal centers of the seated wafers which must be horizontal when the carrier is placed on the coupling 4 7 pod a box having a Standard Mechanical Interface SMIF per SEMI E19 as defined in SEMI E44 4 8 w

12、afer carrier any cassette box pod or boat that contains wafers as defined in SEMI E15 1 ISO Central Secretariat 1 rue de Varemb C P 56 CH 1211 Gen ve 20 Switzerland available in the U S from American National Standards Institute 11 West 42nd Street 13th Floor New York NY 10036 SEMI E57 0600 SEMI 199

13、6 20002 5 Requirements 5 1 Kinematic Coupling Pin Shapes The physical alignment interface on the bottom of the wafer carrier consists of features not specified in this standard that mate with six pins underneath As shown in Figure 1 and defined in Table 1 each pin is radially symmetric about the ver

14、tical center axis line and can be seen as the intersection of a cylinder of diameter d91 and a sphere of radius r93 which might contact a flat plate An additional rounding radius r95 provides contact with angled mating surfaces and blend radii r94 and r96 smooth the resulting edges The final roughne

15、ss height of the over all surface finish must be less than or equal to r97 Dimensions r92 and z91 have zero tolerance because they only give a distance to another toleranced dimension Dimensions in parenthesis are not part of the requirements in this standard but are intended to clarify the preparat

16、ion of manufacturing instructions 5 2 Kinematic Coupling Pin Locations The pins are arranged in three sets with two pins in each set As shown in Figure 2 the outer pin in each set is designated the primary pin for use on a tool load port or vehicle nest or inside a box and the inner pin in each set

17、is designated the secondary pin for use on a robotic arm that would pick up the carrier typically from the side opposite the load face plane The location of each pin is determined with respect to the three orthogonal datum planes defined in Section 4 the horizontal datum plane the facial datum plane

18、 and the bilateral datum plane Figure 3 shows the locations of the kinematic coupling pins as viewed from above and Table 2 defines the locations all of which are bilaterally symmetric about the bilateral datum plane Angle is shown in Figure 3 for clarity and is not part of the requirements in this

19、standard 5 3 Empirical Determination of Datum Plane Locations Given a set of three primary or secondary kinematic coupling pins the datum planes should be determined as follows The two pins that are closest together are the front pins which along with a known vertical direction define a Cartesian co

20、ordinate system The center axis line of each pin is defined to be the vertical line whose x left right coordinate is the average of the maximum protrusions of the pin to the left and to the right and whose y front back coordinate is the average of the maximum protrusions of the pin to the front and

21、to the back The bilateral datum plane is defined to be the vertical plane that contains the center axis line of the rear pin and that is equally distant from the center axis lines of the front pins The facial datum plane is defined to be the vertical plane that is perpendicular to the bilateral datu

22、m plane and whose distance to the center axis line of the rear pin is 1 5 times the average of the distances to the center axis lines of the front pins The horizontal datum plane is defined to be the horizontal plane that is 13 mm 0 51 in below the average of the heights of the highest and lowest pi

23、n tops Once these datum planes have been determined the three kinematic coupling pins can be evaluated to see if they conform to Section 5 1 and 5 2 of this specification If they comply the kinematic coupling pins and datum planes can be used to evaluate the compliance of carriers to standards cited

24、 in Section 6 6 Related Documents 6 1 SEMI Standards SEMI E1 9 Provisional Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers SEMI E19 5 Specification for 300 mm Bottom Opening Standard Mechanical Interface SMIF SEMI E47 1 Provisional Mechanical Specification for Boxes

25、and Pods Used to Transport and Store 300 mm Wafers SEMI E62 Provisional Specification for 300 mm Front Opening Interface Mechanical Standard FIMS SEMI E63 Mechanical Specification for 300 mm Box Opener Loader to Tool Standard BOLTS M Interface SEMI M31 Provisional Mechanical Specification for Front

26、Opening Shipping Box Used to Transport and Ship 300 mm Wafers 6 2 Other Documents Alexander H Slocum Precision Machine Design Society of Manufacturing Engineers Item Code 2597 1992 originally published by Prentice Hall 1992 SEMI E57 0600 SEMI 1996 20003 Table 1 Kinematic Coupling Pin Dimensions Symb

27、ol UsedValue SpecifiedDimension Description d9112 0 05 mm 0 4724 0 002 in Diameter of pin centered on the center axis line r926 mm 0 2362 in Radial distance from the center axis line to the origin of the shoulder radius r95 r9315 0 05 mm 0 5906 0 002 in Radial distance from the intersection of the c

28、enter axis line and z91 to the top of the pin r942 0 1 mm 0 0787 0 004 in Blend radius for the intersection of r93 and r95 r9515 0 05 mm 0 5906 0 002 in Radial distance from the intersection of the horizontal datum plane and r92 to the far shoulder of the pin r962 0 1 mm 0 0787 0 004 in Blend radius

29、 for the intersection of r95 and d91 r970 30 m 12 in maximum Roughness Ra as defined in ISO 4287 z912 mm 0 08 in Vertical distance from the horizontal datum plane to the origin of top radius r93 Table 2 Distances to the Center Axis Lines of the Coupling Pins Symbol Used Value SpecifiedDatum Plane Me

30、asured from Pin Center Axis Line s Measured to r970 30 m 12 in maximum Roughness Ra as defined in ISO 4287r97 x91115 0 05 mm 4 5276 0 002 in bilateralfront right and left primary x9292 0 05 mm 3 6220 0 002 in bilateralfront right and left secondary y9180 0 05 mm 3 1496 0 002 in facialfront right and

31、 left primary y92120 0 05 mm 4 7244 0 002 in facialrear primary y9364 0 05 mm 2 5197 0 002 in facialfront right and left secondary y9496 0 05 mm 3 7795 0 002 in facialrear secondary SEMI E57 0600 SEMI 1996 20004 horizontal datum plane r94 2 0 1 blend final roughness height of over all surface finish

32、 r97 0 30 m Ra z93 12 910 z94 13 z92 9 d91 12 0 05 r92 6 0 origin of r95 r91 1 637 r96 2 0 1 blend r95 15 0 05 r93 15 0 05 z91 2 0 Figure 1 Kinematic Coupling Pin Shape tool load port robotic arm primary pin facial datum plane bilateral datum plane secondary pin primary pin secondary pin Figure 2 Pr

33、imary and Secondary Kinematic Coupling Pins SEMI E57 0600 SEMI 1996 20005 y92 120 0 05 y93 64 0 05 y94 96 0 05 y91 80 0 05 primary pin facial datum plane x91 115 0 05 x92 92 0 05 300 mm wafer bilateral datum plane 34 8 secondary pin primary pin secondary pin Figure 3 Kinematic Coupling Pin Locations

34、 NOTICE SEMI makes no warranties or representations as to the suitability of the standard set forth herein for any particular application The determination of the suitability of the standard is solely the responsibility of the user Users are cautioned to refer to manufacturer s instructions product

35、labels product data sheets and other relevant literature respecting any materials mentioned herein These standards are subject to change without notice The user s attention is called to the possibility that compliance with this standard may require use of copyrighted material or of an invention cove

36、red by patent rights By publication of this standard SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this standard Users of this standard are expressly advised that determination of any such patent rights or copyrigh

37、ts and the risk of infringement of such rights are entirely their own responsibility SEMI E57 0600 SEMI 1996 20006 RELATED INFORMATION 1 APPLICATION NOTES NOTE This related information is not an official part of SEMI E57 but was approved for publication by full letter ballot procedures It is not int

38、ended to modify or supercede the official standard R1 1 The three features on the bottom of the wafer carrier that mate with the six pins underneath are not specified in this standard These three features are recommended to be inverted V shaped grooves each of which extends along a line that is perp

39、endicular to and co planar with the nominal wafer center line as shown in Figure R1 1 Such grooves are likely to work well even when shrunken or slightly misaligned such as when they do not all line up with the nominal wafer center line Other mating features are also possible such as those shown in

40、Figure R1 2 where one pin is contacted on the top Front opening boxes may need to contact the pins on the side to provide pressure against a front mechanical interface Such options are why the top and sides of the pins are toleranced so tightly When designing the mating features on the bottom of the

41、 wafer carrier it is suggested that designers follow the recommendations given in the book listed in Section 6 by Dr Alexander H Slocum Figure R1 1 Recommended Mating Features Figure R1 2 Alternative Mating Features R1 2 All of the dimensions for the kinematic coupling pin surfaces and locations are

42、 given as ranges so that any roundness cylindricity perpendicularity bending or misalignment of the pins must be contained within the limits given R1 3 As shown in Figure R1 3 these couplings can also be used to support 200 mm pods as an addition to the requirements given in SEMI E19 4 However concu

43、rrent implementations for both 200 and 300 mm wafer carriers may be covered by patent claims SEMI E57 0600 SEMI 1996 20007 facial datum plane bilateral datum plane 200 mm wafer 200 mm SMIF pod door Figure R1 3 Application to 200 mm Pods NOTICE SEMI makes no warranties or representations as to the su

44、itability of the standard set forth herein for any particular application The determination of the suitability of the standard is solely the responsibility of the user Users are cautioned to refer to manufacturer s instructions product labels product data sheets and other relevant literature respect

45、ing any materials mentioned herein These standards are subject to change without notice The user s attention is called to the possibility that compliance with this standard may require use of copyrighted material or of an invention covered by patent rights By publication of this standard SEMI takes

46、no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this standard Users of this standard are expressly advised that determination of any such patent rights or copyrights and the risk of infringement of such rights are entirely their own responsibility Copyright by SEMI Semiconductor Equipment and Materials International 805 East Middlefield Road Mountain View CA 94043 Reproduction of the contents in whole or in part is forbidden without express written consent of SEMI

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